Locations:
Min Investment:
Max Investment:
Target Investment:
2000
2000
INVESTMENT DIRECTOR |INTELCAPITAL | 2000 – PRESENT • Invested in over 50 companies by sourcing and evaluating hundreds of deals, issuing term sheets, structuring business collaboration agreements. Help and advice portfolio companies either as a board member or in direct interaction with management on areas such as operational, strategic and go-to market support including M&A. •Director of Health and Bioinformatics Sector | 2015 – PRESENT - Investments include Tobii (eye tracking HW, IPO on NASDAQ Stockholm), Echopixel (3D medical image construction, active), Reveal Biosciences (computational AI based pathology, active), Synthego (informatics based CRISPR, active). •Director of 3D Computing, AR and VR Sector | 2010 – 2015 - Investments include Omek (3D gesture recognition, acquired by Intel), Arcsoft (mobile imaging SW, acquired), Emotient (emotion recognition, acquired), Three Gears (3D gesture recognition, acquired), dotproducts (3D scanning, active) and Occipital (3D sensor, active). •Director of Mobile Content and Services| 2005 – 2010 - Investments include Techfaith (local cellular ODM in China, IPO on NASDAQ), LocationLabs (location based service, acquired), Aicent (mobile roaming, acquired), Jabber (enterprise messaging, acquired), LGC Wireless (enterprise wifi, acquired), Mobile 365 (B-C messaging, acquired), PGP (whole disk encryption, acquired), Clickandbuy (fintech, acquired). •Director of Mobile Sector| 2000 - 2005: - Investment thesis: Fill technology gaps in Intel’s mobile solution. - Investments include Sirf Technology (gps silicon, IPO on NASDAQ), Cambridge Silicon Radio (bluetooth silicon, IPO on FTSE), Sasken (mobile Software, IPO on Sensex) and Integrant (mobile TV, acquired).
1989 - 2000
1995 - 2000
•Built Intel’s fastest $1B (actual recognized revenue on Intel’s P&L) business with a stacked FLASH+SRAM product for the cellular handset market. •Defined silicon roadmaps, product segmentation and technical product specifications for Intel’s $2B memory business. •Represented Intel at the JEDEC silicon standards committee to standardize Intel’s solutions.
1989 - 1995
•Designed and led large design teams on 10 silicon memory products from specification, design, and tape out, validation, packaging and manufacturing for the automotive and cellular market. •Intimate knowledge of all aspects of silicon and system design. •Fault graded the MBUS memory chip for Ford Motor Company with 100% fault coverage. •1994 winner of IEEE award for technical excellence. •Authored over 10 technical patents.